Apple A Series Application Processor Device 2015

APL5598 APL0698 APL5698 ARM® ARMv8 DC 28nm HKMG ARM® ARMv7a DC, 32nm HKMG DC, 28nm HKMG M7 Motion Coprocessor ARM® ARMv7 DC 32 HKMG APL5498 APL0598 DC, 32nm HKMG APL2498APL0498 ARM® CortexTM‐A9 DC, 45nm APL7498 ARM® CortexTM‐A9 DC, 45nm ARM® CortexTM‐A9 DC, 32nm HKMG ARM® CortexTM‐A9 SC, 32nm HKMG APL2498APL0498 APL0398 APL7498 2010 2011 2012 2013 2014 ARM® CortexTM‐A8 SC, 45nm

APL1012 APL0898 APL1012 APL1011 APL1012 ARM® ARMv8a DC, 14/16nm FinFET M9 Motion Coprocessor M9 M9 ARM® ARMv8a DC, 16nm FinFET M9 Motion Coprocessor ARM® ARMv8a DC/TC, 20nm HKMG M8 Motion Coprocessor APL0778 ARM® v7a SC, 28nm HKMG APL0778 2014 2015 2016

 Skyworks  STMicroelectronics LSM6DS3  Broadcom BCM43342  WiFi/BT SoC  AMS AS3923  NFC booster chip S y o s  WiFI LNA +Switch and PA  3D digital gyroscope/ accelerometer /  NXP 65V10(PN548)  NFC controller  Apple APL0778 processor  Dialog D2238A (Apple 338S00046)  TI/NS LM3637  LED Backlight driver  Apple APL0778 processor  Elpida 4Gb system memory  Toshiba 8GB NAND flash M i t  PMIC  ADI AD7149  Capacitance to digital converter  Main storage  MAXIM MAX98730  NXP  Interface chip  MAXIM  STMicroelectronics  IDT P9022  Wireless charger  MAXIM  Audio Codec  MAXIM U k  STM32 MCU  Unknown  MAXIM  Audio amplifier

272x340 or 312x390 ADI AD7166 4Gb S t ADI AD7149 TAOS ALS 8GB NAND Fl h System Memory Elpida 6‐axis MEMs ST32 MCU I2C APL0778 Processor NAND Flash Toshiba/SanDisk TAPTIC ENGINE 338S00046 PMIC SDIO UART P9022 Audio Audio Broadcom BCM43342 Codec AMP AMS AS3923 NXP PN548 4BI SLZ ALGJ +MAX T 9873OEWJ 9 447 BP +AAA 432 TI4BC56LI OPA2376

Manufacturer Device Function ▼Processor Apple Apple APL0778 Microprocessor ‧ Main processor ‧SAMSUNG 28nm LP process ‧ARM v7a architecture ‧Imagination PowerVR SGX543 GPU‧Imagination PowerVR SGX543 GPU ‧PoP package ▼Memory Micron/Elpida N/A ‧4Gb system memory ‧PoP package(die)p g ( ) Toshiba N/A ‧8GB NAND Flash ‧Main storage ▼Radio Frequency BCM43342MKWBG ‧802 11 a/b/g/n Wi‐Fi Broadcom BCM43342MKWBG 802.11 a/b/g/n Wi Fi ‧Bluetooth 4.0 Skyworks Unknown WiFi LNA + Switch Unknown WiFI PA NXP 65V10(PN548) NFC controllerNXP 65V10(PN548) NFC controller AMS AS3923 NFC booster ▼MEMs STMicroelectronics LSM6DS3 6‐Axis accelerometer and gyroscope ▼PMIC Apple Apple 338S00046 (Dialog D2238A) PMIC for Apple APL0778 Processor IDT P9022 Enhanced WPC 1.1 Wireless Power Receiver ▼Audio MAXIM Unknown Audio Codec Unknown Audio Amplifiers

Manufacturer Device Function ▼Touch Screen Controller ADI AD7166‐202ACBZ ARM Cortex M3‐based Cap Touch AD7149‐1ACBZ Capacitance to digital converter ▼O h▼Others Texas Instruments OPA2376 Low‐Noise, Low Quiescent Current, Precision Operational Amplifier TPS6125X TPS6125x 3.5‐MHz High Efficiency Step‐Up Converter In Chip Scale Packaging MAXIM MAX2240 2.5GHz, +20dBm Power Amplifier MAX98730EWJ Unknown NXP Unknown Interface chip National Semiconductor LM3637 LED backlight driver STMi l i U k MCUSTMicroelectronics Unknown MCU Unknown Optical encoder/sensor for digital crown

Apple A9 APL1022/339S00129 Apple A9 APL0898/339S00114 TSMC 16nm FinFET process SAMSUNG 14nm FinFET process

APL1022/APL0898APL1022/APL0898 ‐ TSMC 16nm FinFET/SAMSUNG 14nm FinFET process ‐ Apple 3rd generation ARM v8a architectureApple 3 generation ARM v8a architecture ‐ M9 motion coprocessor integrated ‐ Imagination PowerVR Series 7 GPU ‐ 4‐channel 16‐bits LPDDR4 ‐ MIPI‐DSI/MIPI‐CSI CI I2C UA US M9 ‐ PCIe, I2C, UART, USB ‐ Fingerprint sensor controller ‐ Apple customized PoP packageApple customized PoP package

M9 338S00120‐A1 PMIC 338S00014 338S00105 Audio Codec 338S1285 Audio AMP 16GB/64GB/128GB NVMe SSD

The only thing that’s changed is everything.

iPhone 6S A1688  SKYWORKS RF1347  Texas Instruments 57A6CVI 3539  Apple A9 processor, Apple customized PoP package h l b b d / /4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix  InvenSense MP‐67B  Bosch BMA280  Qualcomm MDM9635MQ  SKYWORKS SKY77812‐19  Qualcomm QFE1100  TriQuint TQF6405  AVAGO AFEM‐8030

iPhone 6S A1688 USI 339S000043 WiFi/BT M d l USI 339S000043 WiFi/BT Module  Ne G98/Murata(?), RF Front‐End Module ALPS HSCDTD007  NXP 66V10  Apple 338S00105 Apple 338S00120‐A1  Texas Instruments 65730AOP  SKYWORKS SKY77357 8  Main storage, 16GB/64GB/128GB SK Hynix : H230DG8UD1ACS, 16GB  SKYWORKS SKY77357‐8  Bosch BMP280 Toshiba : THGBX5G7D2KLFXG, 16GB  Apple 338S1285  NXP1610A3  Qualcomm PMD9635  Qualcomm WTR3925  Rd G54/Murata(?), RF Front‐End Module  Murata 240 Front‐End Module  Apple 338S1285  RFMD RF5150  Texas Instruments 57A5KXI

Rear facing camera 4 7” Front facing camera ALS 4.7 1334x750343S00014 LPDDR4 LPDDR4 4‐channel 16‐bit 16Gb LPDDR4 LPDDR4 TAPTIC ENGINE I2C 16Gb LPDDR4 16/64/128GB NVMe SSDBosch BMA280 Invensense MP67B LPDDR4 I2C I2C/SPI I2C/SPI ALPS HSCDTD007 BMA280 B h 338S00120‐A1 I C/SPI 338S00105 Bosch BMP280 PMIC 338S1285 M9M9 PCIeUARTPCIe USIQualcomm MDM9635M Qualcomm WTR3925 PA Chips 338S00105 Audio Codec NXPNXP 66V10 Audio AMP PA chips is model dependent Lightning 339S00043 Qualcomm QFE1100 MDM9635MWTR3925 Qualcomm PMD9635 p CBTL1610A366V10

M9 338S00122‐A1338S00122 A1 PMIC 338S00014 338S00105 Audio Codec 338S1285 Audio AMP 16GB/64GB/128GB NVMe SSD

iPhone 6S Plus A1687  SKYWORKS RF1347  Apple A9 processor, Apple customized PoP package h l b b d / /4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix  InvenSense EMS‐A  In the iPhone 6s, there is Bosch BMA280 here. But, in the iPhone 6s Plus, there is no chip here but “PCB pad only”  Qualcomm MDM9635MQ  SKYWORKS SKY77812‐19  Qualcomm QFE1100  TriQuint TQF6405  Avago AFEM‐8030

iPhone 6S Plus A1687 USI 339S000043 WiFi/BT M d l  Skyworks SKY13701 ALPS HSCDTD007  USI 339S000043 WiFi/BT Module  Texas Instruments 57A6CVI 3539  NXP 66V10 Apple 338S00122‐A1  Apple 338S00105  Texas Instruments 57A6CVI 3539  Main storage, 16GB/64GB/128GB SK Hynix : H230DG8UD1ACS 16GB  Bosch BMP280  SKYWORKS SKY77357‐8 SK Hynix : H230DG8UD1ACS, 16GB  Apple 338S1285  Qualcomm PMD9635  NXP1610A3  Qualcomm WTR3925  Murata 240 Front‐End Module  Af G54/Murata(?), RF Front‐End Module  Texas Instruments 57A5KXI  Af G54/Murata(?), RF Front End Module  Apple 338S1285  RFMD RF5150

Rear facing camera 5 5” Front facing camera ALS 5.5 1920x1080343S00014 LPDDR4 LPDDR4 4‐channel 16‐bit 16Gb LPDDR4 LPDDR4 TAPTIC ENGINE 16Gb LPDDR4 16/64/128GB NVMe SSD LPDDR4 Invensense EMS‐A I2C 338S00122‐A1 I2C/SPI I2C/SPI ALPS HSCDTD007 Bosch BMP280 PMIC M9M9 338S00105 Audio Codec 338S1285 Audio AMP PCIeUARTPCIe USIQualcomm MDM9635M Qualcomm WTR3925 PA Chips NXPNXP 66V10 Audio Codec PA chips is model dependent Lightning 339S00043 Qualcomm QFE1100 MDM9635MWTR3925 Qualcomm PMD9635 p CBTL1610A366V10

Manufacturer Device Function ▼Processor Apple Apple A9 Microprocessor (APL0898 & APL1022) ‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz ‧Imagination PowerVR 7 series GPU ‧A l t i d P P k‧Apple customized PoP package ▼Memory Micron SAMSUNG SK Hynix D9SND (MT53B256M64D2NL) K3RG1G10BM‐BGCH H9HKNNNBTUMUMR‐NLH ‧16‐bit, Quad‐channel, 16Gb LPDDR4 ‧Apple customized PoP package SK Hynix H9HKNNNBTUMUMR NLH SK Hynix Toshiba ‧NAND Flash‐based storage ‧Apple customized package ‧16GB/64GB/128GB 16GB: SK Hynix H230DG8UD1ACS Toshiba THGBX5G7D2KLFXG ▼PMIC Apple Apple 338S00120‐A1 PMIC for Apple A9 Processor (iPhone 6s) Apple 338S00122‐A1 PMIC for Apple A9 Processor (iPhone 6s Plus) Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor ▼Audio Apple Apple 338S00105 Audio Codec Apple 338S1285 Audio AMP ▼T h S C t ll▼Touch Screen Controller Apple 343S00014 Touch screen controller for 3D Touch ▼Others Texas Instruments 65730AOP Power management IC 57A6CVI 3539 LED backlight Retina display driver 57A5KXI Charger IC NXP 1610A3 USB charging

Manufacturer Device Function ▼Sensors InvenSense MPU‐6700(MP67B) (iPhone 6s) 6‐Axis Gyro and Accelerometer Bosch Sensortech EMS‐A (iPhone 6s Plus) 6‐Axis Gyro and Accelerometer A280(3 LA) (i h 6 ) 3 A i A lBMA280(3P 7LA) (iPhone 6s) 3‐Axis Accelerometer BMP280 Barometer ALPS HSCDTD007 Electronic Compass AMS TSL2586 ALS ▼Radio Frequency USI 339S000043 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 66V10 (PN66V?) NFC controller( ) Qualcomm MDM9635M baseband processor Baseband Processor: ‧20nm process ‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP ‧Rel 9 LTE Cat 6 ‧DC‐HSPA ‧TD‐SCDMA ‧EVDO Rev. B, CDMA 1X ‧GSM ‧QICE, Envelope Tracking ‧Integrated Memory WTR3925 ‧28nm process ‧ GSM/CDMA/W‐CDMA/LTE Transceiver QFE1100 Envelope Power Tracker

Manufacturer Device Function iPhone 6s Model A1688 Skyworks SKY77812‐19 Power Amplifier Module SKY77357‐8 Power Amplifier Module A AFEM 8030 P A lifi M d lAvago AFEM‐8030 Power Amplifier Module RFMD RF5150 Antenna Switch RF1347 Antenna Switch Module TriQuint TQF6405 Power Amplifier Module Murata 240 Front End module Murata(?) Ne G98 RF Front End module Rd G54 RF Front End module iPh 6 Pl M d liPhone 6s Plus Model A1687 Skyworks SKY77812‐19 Power Amplifier Module SKY77357‐8 Power Amplifier Module SKY13701‐17 WLAN front end module Avago AFEM‐8030 Power Amplifier Module RFMD RF5150 Antenna Switch TriQuint TQF6405 Power Amplifier Module Murata 240 Front End module Murata(?) Af G54 RF Front End module

▼Processor Application Processor ‧Dual‐core ‧Apple 3rd generation ARM v8a architecture ‧Imagination PowerVR Series 7 GPUImagination PowerVR Series 7 GPU ‧SAMSUNG 14nm FinFET process TSMC 16nm FinFET process ‧Apple M9 motion coprocessor M9 Apple M9 Coprocessor ‧ Integrated in the Apple A9 processor ▼Memory System Memory ‧ Quad‐Channel 16‐bits LPDDR4 controller ‧ 16Gb density LPDDR4 ‧ Apple customized PoP package System Storage ‧Apple NVMe controller inside Apple A9 ‧16GB/64GB/128GB capacity NAND Flash

▼Radio Frequency WiFi/BT ‧ USI WiFi/BT module Baseband Processor ‧Qualcomm MDM9635M ‧Qualcomm WTR3925 PA Chips ‧Avago ‧Qualcomm ‧RF Micro ‧Skyworks ‧TriQuint NFC 66V10 ▼PMIC PMIC for AP ‧Apple 338S00120‐A1 (iPhone 6s) Apple 338S00122‐A1 (iPhone 6s Plus) PMIC f BPPMIC for BP ‧ Qualcomm PMD9635 ▼Audio d dAudio Codec ‧Apple 338S001285 ‧Apple 338S000105

▼Touch Screen Controller Controller ▼MEMs Gyroscope AccelerometerAccelerometer Barometer Compass

APL1021/343S00074APL1021/343S00074 ‐ TSMC 16nm FinFET process ‐ Apple 3rd generation ARM v8a architecture, 2.26GHzApple 3 generation ARM v8a architecture, 2.26GHz ‐ Integrated M9 motion coprocessor ‐ Imagination PowerVR Series 7 GPU ‐ 8‐channel 16‐bits LPDDR4 memory controller ‐ DisplayPort/MIPI‐CSI CI HSIC I2C UA US (?)‐ PCIe, HSIC, I2C, UART, USB(?) ‐ Fingerprint sensor controller ‐ 147mm2 M9 147mm

M9M9 338S1213 Audio Codec 338S00052‐A1 PMIC 32GB/128GB NVMe SSD 338S00025‐A1 PMIC

iPad Pro  AKM AK8963  Apple 343S1213  This area is reserved for 4G modem which is used in the WiFi + Cellular model  Maxim Integrated MAX98721CEWV pp  Bosch Sensortec BMP280  SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4  Apple A9X processor  NXP Semiconductor 65V10  Toshiba THGBX5G8D4KLDXG 32GB storage  SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4  Apple A9X processor  Bosch Sensortec BMA280  InvenSense MP67B  Apple 343S00025‐A1  Apple 343S00052‐A1  NXP Semiconductors LPC11U37  Fairchild Semiconductor FDMC 6683  USI 339S00045 WiFi/BT Module  Maxim Integrated MAX98721CEWV  NXP Semiconductors LPC11U37  Fresco Logic FL1100SX  NXP Semiconductor 1610A3

iPad Pro Rear facing camera d 12.9” Front facing camera ALS Broadcom BCM15900 Broadcom BCM15900 Parade DP695 TI TPS65144 12.9 2732x2048 LPDDR4 LPDDR4 4‐channel 16‐bit 16Gb LPDDR4 LPDDR4 LPDDR4I2C NXP 8416A1 eDP I2CBosch BMA280 Invensense MP67B LPDDR4I2C LPDDR4 LPDDR4 4‐channel 16‐bit 16Gb LPDDR4 LPDDR4 LPDDR4 I2C/SPI I2C/SPI 32/128GB NVMe SSD AKM AK8963 Bosch LPDDR4 338S1213 A di C d BMP280 338S00052‐A1 PMIC M9MAXIM MAX98721CEWV 338S00025‐A1 PMIC M9 PCIeUARTHSIC USI 339S00045 Qualcomm QFE1100 Qualcomm MDM9625M Qualcomm WTR1625L Audio Codec NXP 65V10 Freesco FL1100SX PCIe NXP LP11U37 This is for WiFi + Cellular model 339S00045MDM9625MWTR1625L Qualcomm PM8019 PA Chips NXP 1610A3 FL1100SX LP11U37 Qualcomm WTR1620

iPad Pro Manufacturer Device Function ▼Processor Apple Apple A9X Microprocessor (APL1021) ‧16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz ‧Imagination PowerVR 7 series GPU ▼Memory SAMSUNG SK Hynix K3RG1G1 OBMKGCH H9HCNNNBTUMLNR‐NLH ‧16‐bit, Octa‐channel, 16Gb LPDDR4 ‧Total system memory capacity is 4GB(16Gbx2) ‧Apple customized package NAND Fl h b d A l P i NVM SSD 32GB d 128GB i SanDisk Toshiba ‧NAND Flash‐based storage ‧Apple customized package ‧Apple Proprietary NVMe SSD, 32GB and 128GB capacity 32GB: Toshiba THGBX5G8D4KLDXG 128GB: SanDisk SDMMSEDF8 ▼PMIC Apple Apple 338S00052‐A1 PMIC for Apple A9X ProcessorApple Apple 338S00052 A1 PMIC for Apple A9X Processor Apple 338S00025‐A1 PMIC for Apple A9X Processor Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor (For Wi‐Fi + Cellular model) ▼Audio▼Audio Apple Apple 338S1213 Audio Codec Maxim Integrated MAX98721CEWV Boosted class amplifier ▼Touch Screen Controller Broadcom BCM15900B0 Touch screen controller ▼MEMs InvenSense MPU‐6700(MP67B) 6‐Axis Gyro and Accelerometer Bosch Sensortech BMA280 3‐Axis AccelerometerBosch Sensortech BMA280 3 Axis Accelerometer BMP280 Barometer AKM AK8963 Electronic Compass

iPad Pro Manufacturer Device Function ▼Others Texas Instruments TPS65144 LCD Bias with Integrated Gamma NXP CBTL1610A3 USB charging L C11U3 C M0 i llLPC11U37 Cortex‐M0 microcontroller NVT8416A1 Unknown Parade DP695 LCD timing controller Fresco Logic FL1100SX PCIe‐to‐USB 3.0 controller Fairchild Semiconductor FDMC 6683 DC/DC Converter FXMA2012 Translator STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB

iPad Pro Manufacturer Device Function ▼Radio Frequency USI 339S000045 (Boradcom BCM4350) ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 65V10 NFC controller For Wi‐Fi + Cellular model Qualcomm MDM9625M baseband processor Baseband Processor: ‧Rel 9 LTE Cat 4(150Mbps) ‧Rel 10 LTE‐FDD CA ‧Rel 10 3C HSDPA+ 63Mbps ‧DC HSUPA ‧TD‐SCDMA ‧DOrBDOrB ‧QICE, Envelope Tracking ‧Integrated Memory WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver WFR1620 GSM/CDMA/W‐CDMA/LTE ReceiverWFR1620 GSM/CDMA/W CDMA/LTE Receiver QFE1100 Envelope Power Tracker Avago A8020 Power Amplifier Module TriQuint TQF6410 Power Amplifier Module TQF6430 Power Amplifier Module RFMD RF5159 Antenna Switch Module RF5145 Antenna Switch RF5147A Antenna SwitchRF5147A Antenna Switch

iPad Pro  ST Microelectronics AS5C Y533  ST Microelectronics STML151UCY6, ARM Cortex‐M3 MCU L05286 QS4 VG Z SGP 528 EWX 01129 (STMicroelectronics STM32L052x6)  Bosch Sensortec BMA280  Cambridge Silicon Radio (Qualcomm)CSR1012A05  Bosch Sensortec BMA280  8529043 343S00008‐A1(Customized part for Apple?)

iPad Pro Manufacturer Device Function ▼Apple Pencil ST Microelectronics STML151UCy6 ARM Cortex‐M3 MCU AS5C Y533 unknown h S h 280 3 A i A lBosch Sensortech BMA280 3‐Axis Accelerometer Qualcomm/CSR CSR1012A05 Bluetooth Smart chip STMicroelectronics L05286 QS4 VG Z SGP 528 (STM32L052x6) Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB Unknown(MAXIM?) EWX 01129 unknown Unknown (Customized for Apple?) 8529043 343S00008‐A1 unknown ▼Smart Keyboard ST Microelectronics STM32F103VB 72MHz ARM Cortex‐M3 MCU

iPad Pro ▼Processor Application Processor ‧Dual‐core ‧Apple 3rd generation ARM v8a architecture ‧Imagination PowerVR Series 7 GPUImagination PowerVR Series 7 GPU ‧TSMC 16nm FinFET process ‧Apple M9 motion coprocessor M9 Apple M9 Coprocessor ‧ Integrated in the Apple A9X processor ▼Memory System Memory ‧Eight‐Channel 16‐bits LPDDR4 controller ‧16Gb density LPDDR4 ‧Apple customized package System Storage ‧Apple NVMe controller inside Apple A9 ‧16GB/64GB/128GB capacity NAND Flash

iPad Pro ▼Radio Frequency WiFi/BT ‧Broadcom BCM4350 ‧USI WiFi/BT module Baseband Processor ‧Qualcomm MDM9625M ‧Qualcomm WTR1625L ‧Qualcomm WTR1620 ‧Qualcomm QFE1100 NFC 65V10 ▼PMIC PMIC for AP ‧Apple 338S00052‐A1 Apple 338S00025‐A1 PMIC for BP ‧ Qualcomm PM8019 ▼Audio Audio ‧Apple 338S001213 ‧Maxim MAX98721CEWV

iPad Pro ▼Touch Screen Controller Controller ▼MEMs Gyroscope AccelerometerAccelerometer Barometer Compass

338S00040‐AZ PMIC 338S1116 Audio Codec

iPad Touch iPod touch A8 chip, 8MP iSight camera, 5 stunning colors. Space gray, blue, gold, pink, and silver.Space gray, blue, gold, pink, and silver.

iPad Touch  NXP LPC18B1UK  Texas Instruments 343S0645 Borsch BMA280  NXP LPC18B1UK  Apple A8 processor  Broadcom BCM5976  Texas Instruments TPS65730A0P 8Gb LPDDR3, PoP, SK Hynix H9CKNNN8KTMRWR‐NTH  Apple 338S00040‐AZ  USI 339S0231 WiFi/BT module pp  InvenSense MP67B  Main storage, 16GB/64GB/128GB  Apple 338S1116 SK Hynix : H230DG8UD1ACS, 16GB  NXP 1610A2

iPad Touch 4” 1136x640 Front facing camera Rear facing camera, ALS Broadcom BCM5976 Texas Instruments 343S0645 g LPDDR3 2 8Gb LPDDR3 LPDDR3 Invensense MP67B I2C SK Hynix H9CKNNN8KTMRWR I2C/SPIBosch BMP280 16/32/64/128GB NAND Flash 338S00040‐AZ PMIC 338S1116 Audio Codec SDIOUART USINXP PMICAudio Codec Broadcom BCM43451Lightning 339S0231 CBTL1610A2

iPad Touch Manufacturer Device Function ▼Processor Apple Apple A8 Microprocessor (Apple APL1011) ‧20nm process ‧Dual‐core, ARM v8a architecture, 1.1GHz ‧Imagination PowerVR Series6XT GPU, 4‐clusters ‧A l t i d P P k‧Apple customized PoP package NXP NXP LPC18B1 (Apple M8 Motion Coprocessor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 ▼Memory SK Hynix H9CKNNN8KTMRWR‐NTH ‧32‐bit, Dual‐channel, 8Gb LPDDR3 ‧Apple customized PoP package Toshiba ‧NAND Flash‐based storage ‧Apple customized ‧16GB/32/GB/64GB/128GB 16GB: THGBX3G7D2KLA0C 128 Gb (16 GB) NAND Flash ▼PMIC▼PMIC Apple Apple 338S00040‐AZ PMIC for Apple A8 Processor ▼Audio Apple Apple 338S1116 Audio Codec ▼Touch Screen Controller Texas Instruments 343S0645 Touch Screen Controller Broadcom BCM5976 Touch Screen Controller ▼MEMs▼MEMs InvenSense MPU‐6700(MP67B) 6‐Axis Gyro and Accelerometer Bosch Sensortech BMA280 3‐Axis Accelerometer ▼Others Texas Instruments TPS65730A0P Power Management IC NXP 1610A2 USB charging

iPad Touch Manufacturer Device Function ▼Radio Frequency USI 339S0231 Broadcom BCM43451 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0

iPad Touch ▼Processor Application Processor ‧Dual core ‧ARM v8a architecture ‧Imagination PowerVR Series 6XT GPU, 4‐clustersImagination PowerVR Series 6XT GPU, 4 clusters ‧20nm process Apple M8 Motion Coprocessor ‧ LPC18B1 ▼Memory System Memory ‧ Dual‐Channel ‧ LPDDR3 ‧ 8Gb density ‧ Apple customized PoP package Storage ‧Apple customized NAND Flash ‧16GB/32GB/64GB/128GB capacity

iPad Touch ▼Radio Frequency WiFi/BT ‧ Broadcom BCM4354 ‧ USI module ▼PMIC▼PMIC PMIC for AP ‧ Dialog Semiconductor ▼Audio Audio Codec ▼Touch Screen Controller Controller ▼MEMs Gyroscope Accelerometer

Unknown Part number PMIC 338S1213 Audio Codec

iPad mini 4 iPad mini 4iPad mini 4 Mighty. Small. There’s more to mini than meets the eye. The new iPad mini 4 putsThere s more to mini than meets the eye. The new iPad mini 4 puts uncompromising performance and potential in your hand. It’s thinner and lighter than ever before, yet powerful enough to help you take your ideas even further.

iPad mini 4  Apple A8 Processor  AKM AK8963 This area is used for WWAN function in Wi‐Fi + Cellular model, 1. Qualcomm MDM9625M 2. Qualcomm PM8019 3. Qualcomm WTR1625L 4. Qualcomm WFR1620 h  NAND Flash‐based storage, 16GB/64GB/128GB capacity 5. PA chips: TriQuint, Avago, RF Micro, SKYWORKS  NXP 65V10 NFC Controller  NXP LPC18B1UK, Apple M8 motion coprocessor  Apple 338S1213 audio codec  Bosch Sensortec BMP280, Barometer  Bosch Sensortec BMA280, Accelerometer  Unknown part number, PMIC for Apple A8 processor Dialog Semiconductor  Unknown part number,  Maxim Integrated MAX98721BEWV  NXP CBTL1610(1610A1) PMIC for Apple A8 processor, Dialog Semiconductor  Broadcom BCM5976  Texas Instruments 51ACK0I 343S0583  USI 339S00045 WiFi/BT module  Apple A8 Processor, Dual‐Channel LPDDR3, 16Gb LPDDR3, SK Hynix

iPad mini 4 Rear facing camera Touch Screen 7.9”dd Texas Front facing camera 7.9 2048x1536 ALS Broadcom BCM5976 Broadcom BCM5976 Instruments 51ACK0I 343S0583 eDP B418/B412 LPDDR3 LPDDR3 8Gb LPDDR3 SK Hynix I2C/SPI I2C AKM 8963 Bosch BMA280 H9CKNNN8KTBUSR 16/64/128GB NAND Flash I2C/SPI 8963 Bosch BMP280 NAND Flash PMIC 338S1213 Audio Codec MAXIM MAX98721 NXP NVT8416 PCIeUARTHSIC USI 339S00045 Qualcomm MDM9625M Qualcomm WTR1625L Qualcomm WFR1620 PA Chips NXP 1610A1 NXP PN548 For Wi‐Fi + Cellular model only Lightning Qualcomm PM8019

iPad mini 4 Manufacturer Device Function ▼Processor Apple Apple A8X Microprocessor (Apple APL1012) ‧20nm process ‧Tri‐core, ARMv8 architecture ‧Imagination PowerVR 6‐Series GPU, 8 clusters NXP NXP LPC18B1 (Apple M8 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 ▼Memory SK Hynix H9CKNNN8KTBUSR‐NTH ‧32‐bit, Dual‐channel, 8Gb LPDDR3 T LPDDR3 hi T l d i i 2GB‧Two LPDDR3 memory chips. Total density is 2GB SK Hynix ‧NAND Flash‐based storage ‧Apple customized ‧16GB/64GB/128GB ▼PMIC Apple Unknown part number PMIC for Apple A8 Processor ▼Audio Apple Apple 338S1213 Audio Codec Maxim Integrated MAX98721BEWV Boosted Class Amplifierg p ▼Touch Screen Controller Texas Instruments 48WHXDP 343S0583 Line Driver Broadcom BCM5976TCIKUBB6G Touch Screen Controller ▼MEMs Unknown Unknown part number (Chip package marking: B418/B412) Unknown Bosch Sensortech BMA280 3‐Axis Accelerometer BMP280 Barometer AKM AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output

iPad mini 4 Manufacturer Device Function ▼ Display Parade Technologies DP675 LCD driver Texas Instruments TPS65143A LCD Bias Solution for LCD Panels ▼Radio Frequency▼Radio Frequency USI 339S00045 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP PN548(NXP 65V10 ) NFC controller Qualcomm MDM9625M baseband processor Baseband Processor: ‧ Rel 9 LTE Cat 4(150Mbps) ‧ Rel 10 LTE‐FDD CA ‧ Rel10 3C HSDPA+ 63Mbps ‧ DC HSUPA TD SCDMA‧ TD‐SCDMA ‧ DOrB ‧ QICE, Envelope Tracking ‧ Integrated Memory WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver PM8019 PMIC for Qualcomm MDM9625M baseband processor ▼Others NXP 1610A1 USB charging ICNXP 1610A1 USB charging IC NVT8416 Unknown

iPad mini 4 ▼Processor Application Processor ‧Dual core ‧ARM v8 architecture ‧Imagination PowerVR 6 series GPU, 8 clustersImagination PowerVR 6 series GPU, 8 clusters ‧20nm process Apple M8 Coprocessor ‧ LPC18B1 ▼Memory System Memory ‧ Quad‐Channel 32‐bit LPDDR3 controller ‧ Two Dual‐channel 32‐bit 8Gb density LPDDR3 chips ‧ Apple customized package StorageStorage ‧Apple customized NAND Flash ‧16GB/64GB/128GB capacity

iPad mini 4 ▼Radio Frequency WiFi/BT ‧ USI module Baseband Processor ‧Qualcomm MDM9625M ‧Qualcomm WTR1625L/WFR260 PA Chips ‧Avago ‧Qualcomm ‧RF Micro ‧Skyworks ‧TriQuint NFC PN548 ▼PMIC PMIC for AP ‧ Dialog Semiconductor PMIC for BP ‧ Qualcomm PM8019Qualcomm PM8019 ▼Audio Audio Codec

iPad mini 4 ▼Touch Screen Controller Controller ▼MEMs Accelerometer Barometer Compass

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SMSC LAN9730 USB 2.0 10/100 Ethernet controller  MegaChip DP2700A1, DP‐to‐HDMI  Apple A8 processor Fairchild Semiconductor DF25AU  Apple A8 processor SK Hynix H9CKNNNBKTBRWR‐NTH 16Gb LPDDR3, PoP  Apple 338S00057, PMIC(?)  USI 339S00045 WiFi/BT module Texas Instruments TPS6213x

 Unknown vendor, function  Main Storage 32GB: SK Hynix H2JTEG8VD1BMR  NXP 1112 0206 5271B4K, Unknown function

DP2700A1 99527001 MYSVQ901 LPDDR3 Q M LPDDR3 2‐channel 8Gb LPDDR3 32/64GB NAND Flash SMSC LAN9730‐ABZJ USB 2.0 338S0057‐AZ UART PA6I TI 56I CR33 1112 0206 NXP V301 DF25AU 010D 030D PCIe USI 0206 5271B4K N F 57K C6XF G4 339S00045

Manufacturer Device Function ▼Processor Apple Apple A8 Microprocessor (Apple APL1011) ‧20nm process ‧Dual‐core, ARMv8 architecture, 1.4GHz ‧Imagination PowerVR 6 series GPU ‧A l t i d P P k‧Apple customized PoP package ▼Memory SK Hynix H9CKNNN8KTMRWR‐NTH ‧32‐bit, Dual‐channel, 16Gb LPDDR3 ‧Apple customized PoP package SK Hynix H2JTEG8VD1BMR ‧Main storage ‧32GB/64GB ‧32GB: SK Hynix H2JTEG8VD1BMR ▼PMIC Apple Apple 338S00057 AZ PMIC for Apple A8 Processor(?)Apple Apple 338S00057‐AZ PMIC for Apple A8 Processor(?) ▼Communication Universal Scientific Industrial 339S00045 WiFi/BT module SMSC LAN9730 USB 2.0 10/100 Ethernet controller ▼Display MegaChips DP2700A1 DP‐to‐HDMI ▼Others Texas Instruments TPS6213x 3V 17V 3A Step Down ConverterTexas Instruments TPS6213x 3V‐17V 3A Step‐Down Converter Fairchild Semiconductor DF25AU 010D 030D NXP 1112 0206 5271B4K Unknown Unknown V301 F 57K C6XF G4 Unknown

Apple A Series Application Processor Device 2015

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Apple A Series Application Processor Device 2015