A Global Fabless Semiconductor Group Offering Connectivity IPs and Chiplet Design Turnkey Services

Egis touch sensor gives you a fast, convenient, and secure way to pay with just one touch.

Dynamic and real time sensor calibration for both wet and dry fingers

The only passive type fingerprint sensor available on the market.

Proprietary matcher enables 360 degree fingerprint authentication.

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FIDO technology specifications and protocols offer its users the options of using an easy–to–use, strongly–secure open standards–based 2nd factor device for authentication.

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Egis authentication uses FIDO certified products to provide end-to-end authentication for payment with high security.

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InPsytech's solutions are designed to support smart vehicles, advanced driver-assistance systems (ADAS), and autonomous driving applications.

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The smallest fingerprint touch module available on the market, suitable for replacing the mobile home button or the volume key. Smallest fingerprint/navigation sensor module, sole source on the market

Egis Breaking News

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogeneous chiplet integration.
────Design & Reuse   2025.07.16

Egis makes initial strides in South Korea as InPsytech joins SAFE

InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has beenselected to join the Samsung Advanced Foundry Ecosystem (SAFE) as an IP partner. This recognition stems from InPsytech’soutstanding performance in open NAND flash interface (ONFI) high-performance IP solutions. InPsytech plans to continueexpanding its IP portfolio within Samsung’s ecosystem, particularly by strengthening applications for UCIe IP.
────DIGITIMES Asia   2025.05.19