中国集成电路出口大增超20% 国内外技术差距持续缩小
2024年全球半导体市场强势复苏 | Global Semiconductor Market Shows Strong Recovery in 2024
2024年，全球半导体行业迎来了令人振奋的发展局面，市场规模呈现出显著的增长态势。世界集成电路协会（WICA）数据显示，2024年全球半导体市场预计达到6202亿美元，同比增长17%，一扫2023年同比减少8.5%的阴霾，强势触底反弹，迈入"硅周期"上行阶段。
The global semiconductor industry has witnessed exciting developments in 2024, with market size showing significant growth. According to World Integrated Circuit Association (WICA) data, the global semiconductor market is expected to reach $620.2 billion in 2024, a 17% year-on-year increase, completely reversing the 8.5% decline in 2023 and marking a strong rebound into the upward phase of the "silicon cycle".
中国市场表现亮眼 | China Market Shows Outstanding Performance
2024年中国大陆集成电路市场规模为1865亿美元，占全球半导体市场份额30.1%，增速达20.1%。亚太地区整体保持较快速增长，持续为行业发展添砖加瓦；与之形成对比的是，日本和欧洲市场由于面临技术升级缓慢、需求疲软以及宏观经济不确定性等挑战，发展状态相对低迷。
China's mainland IC market reached $186.5 billion in 2024, accounting for 30.1% of the global semiconductor market share with a growth rate of 20.1%. The Asia-Pacific region as a whole maintained relatively rapid growth, continuing to contribute to industry development. In contrast, Japan and European markets faced challenges such as slow technological upgrades, weak demand and macroeconomic uncertainties, showing relatively sluggish development.
产品与应用分析 | Product and Application Analysis
聚焦产品层面，逻辑芯片和存储芯片成为增长的"双引擎"，预计分别增长21%和61.3%，这背后是全球人工智能、高效能运算（HPC）需求的爆发式增长，强力带动了相关算力、存储芯片的市场需求。从应用结构分析，计算及通信成为半导体产业主要的两大增量市场，分别增长18.4%和17.9%，汽车市场位列第三，同比增长16.7%，唯有政府采购领域出现负增长，同比下降20%。
At the product level, logic chips and memory chips have become the "twin engines" of growth, with expected increases of 21% and 61.3% respectively. This is driven by the explosive growth in global demand for artificial intelligence and high-performance computing (HPC), strongly boosting market demand for related computing power and memory chips. From an application perspective, computing and communications have become the semiconductor industry's two major growth markets, increasing by 18.4% and 17.9% respectively, with the automotive market ranking third at 16.7% year-on-year growth. Only government procurement showed negative growth, down 20% year-on-year.
中国半导体产业表现 | Performance of China's Semiconductor Industry
在全球半导体行业蓬勃发展的浪潮中，中国半导体产业凭借自身坚实的基础与强大的韧性，展现出令人瞩目的规模优势。从进出口数据来看，尽管面临外部环境的诸多挑战，中国半导体进出口额依旧保持高位运行，2024年前11个月，我国集成电路出口金额达1.03万亿元，同比增长20.3%，再次突破万亿关口；进口方面，中国长期位列全球集成电路进口首位，强大的进口需求既反映了国内庞大的市场容量，也为产业发展提供了多元的技术资源与产品借鉴，持续推动着产业的迭代升级。
Amid the wave of global semiconductor industry development, China's semiconductor industry has demonstrated remarkable scale advantages based on its solid foundation and strong resilience. Import and export data shows that despite numerous external challenges, China's semiconductor trade volume remains high. In the first 11 months of 2024, China's IC exports reached 1.03 trillion yuan, a year-on-year increase of 20.3%, once again breaking the trillion threshold. On the import side, China has long ranked first in global IC imports, with strong import demand reflecting both the huge domestic market capacity and providing diverse technical resources and product references for industrial development, continuously driving industrial iteration and upgrading.
技术突破与创新 | Technological Breakthroughs and Innovations
光刻技术作为集成电路制造的"心脏"，其重要性不言而喻。思坦科技联合南方科技大学、香港科技大学、国家第三代半导体技术创新中心（苏州）攻坚克难，基于高功率AlGaN（铝镓氮）深紫外Micro-LED显示研发出无掩膜光刻技术。光刻胶作为芯片制造光刻环节的关键感光材料，其技术长期被国外企业"卡脖子"，我国超九成光刻胶依赖进口。在此困境下，华中科技大学与湖北九峰山实验室组成的联合研究团队挺身而出，成功研发出"双非离子型光酸协同增强响应的化学放大光刻胶"。
As the "heart" of integrated circuit manufacturing, the importance of lithography technology is self-evident. Sitan Technology, in collaboration with Southern University of Science and Technology, Hong Kong University of Science and Technology, and the National Innovation Center for Advanced Optoelectronic Chips (Suzhou), has developed maskless lithography technology based on high-power AlGaN deep ultraviolet Micro-LED displays. Photoresist, a key photosensitive material in the chip manufacturing lithography process, has long been "strangled" by foreign companies, with over 90% of China's photoresist relying on imports. Facing this challenge, a joint research team from Huazhong University of Science and Technology and Hubei Jiufengshan Laboratory successfully developed a "chemically amplified photoresist with dual non-ionic photoacid synergistic enhancement response".
未来展望 | Future Outlook
展望未来，半导体行业机遇与挑战并存。一方面，随着人工智能、物联网、新能源汽车等新兴技术的深度融合与广泛应用，对高性能芯片、先进半导体器件的需求将呈井喷之势，持续拓展产业边界；另一方面，全球产业链重构、贸易保护主义等不确定性因素，以及技术迭代加速带来的研发压力，都要求行业参与者具备敏锐的洞察力、坚韧的创新力与果敢的应变力。
Looking ahead, the semiconductor industry faces both opportunities and challenges. On one hand, with the deep integration and widespread application of emerging technologies such as artificial intelligence, IoT, and new energy vehicles, demand for high-performance chips and advanced semiconductor devices will surge, continuously expanding industry boundaries. On the other hand, uncertainties such as global supply chain restructuring and trade protectionism, along with R&D pressures from accelerating technological iterations, require industry participants to possess keen insight, resilient innovation capabilities, and decisive adaptability.
